International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017)
Berkeley, CA, USA, June 19-23, 2017.
The Symposium on Solid and Physical Modeling 2017 (SPM-2017) will be co-located in Berkeley, California with Shape Modeling International (SMI) as part of the International Convention on Shape, Solid, Structure & Physical Modeling (S3PM-2017) (https://s3pm.icsi.berkeley.edu/s3pm/).
SPM seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas. The symposium is organized with the support of the Solid Modeling Association (SMA), which will award the 2017 Pierre Bézier Prize for contributions to solid, shape, and physical modeling during the conference.
Accepted full-length papers will be published as a journal special issue in Computer-Aided Design (Elsevier).
###UPDATES
- NEW! The NSF has provided funding (pending final processing) to support registration and travel for a limited number of students from US educational institutions or US citizens who are graduate students in universities outside of the US.
- Instructions for application will be posted soon.
- There will be a joint poster session between SPM and SMI. You can submit proposals for posters before May 5th.
- The SPM and SMI paper submission rounds are over. However, researchers and practitioners are welcome to submit relevant papers to the Fabrication and Sculpting Event (FASE) before May 15th.
- The early registration (offering $100 discount for all registrations) is available until May 17th.
- The Convention venue is the Banatao Auditorium at UC Berkeley.
- A Block of rooms is reserved for the guests in Hotel Shattuck Plaza near the convention venue. Group rates are available until the block sells out and before May 17th, whichever comes first. The other reserved block (Bancroft Hotel) is already sold out. We are working to explore alternative lodging options.
- We have three confirmed keynote speakers so far: Hao Li, Kristina Shea, and Jonathan R. Shewchuk will talk about new frontiers for S3PM!
- So far, we have five financial sponsors supporting S3PM: Autodesk (Gold), Siemens (Gold), PARC (Gold), University of Wisconsin (Gold), and Elsevier (Silver).
###IMPORTANT DATES
Important dates for SPM: https://s3pm.icsi.berkeley.edu/s3pm/spm.html#dates
WHEN: SPM (June 19th-21st) followed by SMI (June 21st-23rd)
WHERE: UC Berkeley Campus, Berkeley, California, USA
TOPICS
- 3D fabrication/printing/manufacturing technologies
- Anisotropic/heterogeneous/composite materials
- Applied algebraic and differential geometry
- Applied computational geometry and topology
- Conceptual, collaborative, and distributed design
- Computational fabrication
- Curve, surface, and manifold modeling
- Dimensioning and tolerancing
- Feature modeling, recognition, and understanding
- Geometric algorithms
- Geometric and topological representations
- Geometric constraint solving and parametric modeling
- Geometric interpolation and smoothing
- Geometry generation and processing
- Geometry compression and transmission
- Isogeometric analysis
- Meshing and mesh optimization
- Multi-resolution modeling
- Numerical analysis of geometric algorithms
- Physically-based modeling and simulation
- Product data exchange, standards, and interoperability
- Reverse engineering/reconstruction of surfaces/solids
- Robustness and validity of geometric computations
- Shape modeling, synthesis, and analysis
IMPORTANT DATES FOR THE SUBMISSION AND REVIEW OF FULL PAPERS:
Abstract for full papers: Tuesday, February 18, 2017
Full paper submission: Monday, February 24, 2017
First review notification: Friday, April 7, 2017
Final notification of acceptance: Friday, April 28, 2017
Camera ready full papers due: Friday, May 5, 2017
S3PM Convention Chair:
Vadim Shapiro (University of Wisconsin-Madison)
SPM Conference Chair:
Sara McMains (University of California, Berkeley)
SPM Program Chairs:
Mario Botsch (Bielefeld University)
Stefanie Hahmann (University of Grenoble Alpes)
Jessica Zhang (Carnegie Mellon University)